Mechanics and materials for electronic packaging : presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994 / co-sponsored by the Applied Mechanics ... [y otros.] Divisions, ASME, Materials and Mechanics, and Computational Mechanics Divisions, JSME.
Tipo de material:![Texto](/opac-tmpl/lib/famfamfam/BK.png)
Contenidos:
Contenido:v.1. Design and processes issues in electronic packaging / edited by William T. Shen, Luu T. Nguyen, Walter L. Winterbottom -- v. 2. Thermal and mechanical behavior and modeling / edited by Michael A. Schen, H. Abe, Ephraim Suhir -- v. 3. Coupled field behavior in materials / edited by M.L. Dunn, M. Taya, M. Saka.
Tipo de ítem | Biblioteca actual | Colección | Clasificación | Copia número | Estado | Fecha de vencimiento | Código de barras | Reserva de ítems |
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Libros Libros | General | TK7870.15/M43 1994 (Navegar estantería(Abre debajo)) | 1 | Disponible | 11123 |
Total de reservas: 0
Includes bibliographical references and indexes.
Contenido:v.1. Design and processes issues in electronic packaging / edited by William T. Shen, Luu T. Nguyen, Walter L. Winterbottom -- v. 2. Thermal and mechanical behavior and modeling / edited by Michael A. Schen, H. Abe, Ephraim Suhir -- v. 3. Coupled field behavior in materials / edited by M.L. Dunn, M. Taya, M. Saka.
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