Wafer bonding :  applications and technology / 
M. Alexe, U. Gösele (eds.) 
 - 499 páginas 
 - Springer series in materials science  75 .
 - Springer series in materials science  .
<br/><br/><label>ISBN: </label>3540210490 (papel alcalino) 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Semiconductores--Encolado<br/>Láminas semiconductoras
<br/><br/><label>LC Class. No.: </label>TK7871.85  / W33