| 000 | 01031nam a2200301zi 4500 | ||
|---|---|---|---|
| 005 | 20230621111043.0 | ||
| 008 | 050304c20032003gw a 001 0 eng | ||
| 020 | _a3540678190 (papel laclino) | ||
| 035 | _aMX001001018668 | ||
| 040 |
_aDLC _bspa _cDLC _dDLC _dUNAMX |
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| 050 | 0 | 0 |
_aTK3401 _bL69 |
| 084 | _aGeneral | ||
| 245 | 0 | 0 |
_aLow dielectric constant materials for IC applications / _cP.S. Ho, J. Leu, W.W. Lee, eds. |
| 264 | 1 |
_aBerlin : _bSpringer Verlag, _cc2003 |
|
| 300 |
_axix, 309 páginas : _bilustraciones |
||
| 490 | 0 |
_aSpringer series in advanced microelectronics, _v9 |
|
| 650 | 0 | _aAislantes eléctricos | |
| 650 | 0 | _aDieléctricos | |
| 650 | 0 | _aCircuitos integrados | |
| 700 | 1 |
_aHo, P. S., _eeditor |
|
| 700 | 1 |
_aLeu, Jihperng, _d1958- , _eeditor |
|
| 700 | 1 |
_aLee, Wei William, _eeditor |
|
| 830 |
_aSpringer series in advanced microelectronics _x 1437-0387 |
||
| 336 |
_atexto _2rdacontent |
||
| 337 |
_asin medio _2rdamedia |
||
| 338 |
_avolumen _2rdacarrier |
||
| 999 |
_c12511 _d12511 |
||