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| 005 | 20230621111109.0 | ||
| 008 | 070430s2006 ne a 000 0 eng d | ||
| 020 | _a1402045786 (encuadernado en tela) | ||
| 020 | _a9781402045783 (encuadernado en tela) | ||
| 035 | _aMX001001099413 | ||
| 040 |
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| 050 | 4 |
_aTK7874 _bD97 |
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| 084 | _aGeneral | ||
| 100 | 1 |
_aDziuban, Jan A., _eautor |
|
| 245 | 1 | 0 |
_aBonding in microsystem technology / _cJ.A. Dziuban |
| 264 | 1 |
_aNetherlands : _bSpringer Verlag, _cc2006 |
|
| 300 |
_axviii, 331 páginas : _bilustraciones |
||
| 490 | 0 |
_aSpringer series in advanced microelectronics, _v24 |
|
| 650 | 4 | _aMicrotecnología | |
| 650 | 4 | _aSistemas microelectromecánicos | |
| 830 |
_aSpringer series in advanced microelectronics _x 1437-0387 |
||
| 336 |
_atexto _2rdacontent |
||
| 337 |
_asin medio _2rdamedia |
||
| 338 |
_avolumen _2rdacarrier |
||
| 999 |
_c13330 _d13330 |
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