| 000 | 01174nam a2200325zi 4500 | ||
|---|---|---|---|
| 005 | 20230621111110.0 | ||
| 008 | 070525s2005 gw a 00 0 eng | ||
| 020 | _a3540210814 (empastado, cubierta dura) | ||
| 035 | _aMX001001101880 | ||
| 040 |
_aOHX _bspa _cOHX _dCUS _dCtY _dDLC _dUNAMX |
||
| 050 | 0 |
_aTK7874 _bH534 |
|
| 082 | 0 | 0 |
_a621.39/5 _222 |
| 084 | _aGeneral | ||
| 245 | 0 | 0 |
_aHigh dielectric constant materials : _bVLSI MOSFET applications / _cH.R. Huff, D.C. Gilmer (eds.) |
| 246 | 3 | 0 | _aVLSI MOSFET applications |
| 264 | 1 |
_aBerlin : _bSpringer Verlag, _cc2005 |
|
| 300 |
_axxiv, 710 páginas : _bilustraciones |
||
| 490 | 0 |
_aSpringer series in advanced microelectronics, _v16 |
|
| 650 | 0 | _aCircuitos integrados en muy gran escala | |
| 650 | 0 | _aSemiconductores | |
| 650 | 0 |
_aCircuitos de arreglo de compuertas _xMateriales |
|
| 650 | 0 | _aDieléctricos | |
| 700 | 1 |
_aHuff, Howard R., _eeditor |
|
| 700 | 1 |
_aGilmer, D. C. _q(David C.), _eeditor |
|
| 830 |
_aSpringer series in advanced microelectronics _x 1437-0387 |
||
| 336 |
_atexto _2rdacontent |
||
| 337 |
_asin medio _2rdamedia |
||
| 338 |
_avolumen _2rdacarrier |
||
| 999 |
_c13361 _d13361 |
||