| 000 | 01126nam a2200301zi 4500 | ||
|---|---|---|---|
| 005 | 20230621111114.0 | ||
| 008 | 070827m20079999xxua 001 0 eng d | ||
| 020 | _a0387279741 | ||
| 020 | _a9780387279749 (encuadernado, cubierta dura) | ||
| 035 | _aMX001001110850 | ||
| 040 |
_aUKM _cUKM _dBAKER _dNDD _dYDXCP |
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| 050 | 4 |
_aTK7874 _bM447 |
|
| 082 | 0 | 4 |
_a621.381 _222 |
| 084 | _aGeneral | ||
| 245 | 0 | 0 |
_aMicro- and opto-electronic materials and structures : _bphysics, mechanics, design, reliability, packaging / _cedited by E. Suhir, Y. C. Lee, C. P. Wong |
| 264 | 1 |
_aNew York : _bSpringer Verlag, _cc2007 |
|
| 300 |
_avolúmenes : _bhojas (algunas a color) |
||
| 505 | 0 | _aContenido: v. 1. Materials physics/Materials mechanics -- v. 2. Physical design/Reliability and packaging | |
| 650 | 4 | _aMicroelectrónica | |
| 650 | 4 | _aOptoelectrónica | |
| 700 | 1 |
_aSuhir, Ephraim, _eeditor |
|
| 700 | 1 |
_aLee, Y. C. _q(Yee Chun), _eeditor |
|
| 700 | 1 |
_aWong, C. P., _d1947- , _eeditor |
|
| 336 |
_atexto _2rdacontent |
||
| 337 |
_asin medio _2rdamedia |
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| 338 |
_avolumen _2rdacarrier |
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| 999 |
_c13495 _d13495 |
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