| 000 | 01009nam a2200265zi 4500 | ||
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| 005 | 20230621110633.0 | ||
| 008 | 040830s1992 000 0 eng d | ||
| 020 | _a1558991697 | ||
| 035 | _aMX001000596117 | ||
| 050 |
_aTK7870 _bE58 1992 |
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| 084 | _aSerie | ||
| 245 | 0 | 0 |
_aElectronic packaging materials science vi : _bSymposium held april 27-30, 1992, san francisco, california, u.s.a. / _cEds. Paul s. ho...[y otros.] |
| 264 | 1 |
_aPittsburgh, pennsylvania : _bMaterials researh society, _cc1992 |
|
| 300 | _a439 páginas | ||
| 490 | 0 |
_aMaterials Research Society symposium proceedings _v264 |
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| 650 |
_aEncapsulado electrónico _vCongresos |
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| 650 |
_aEncapsulado electrónico _xMateriales _vCongresos |
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| 700 |
_aHo, Paul S., _eeditor |
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| 710 | 2 | _aMaterials Research Society | |
| 830 | 0 |
_aMaterials Research Society symposium proceedings _x0272-9172 |
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| 336 |
_atexto _2rdacontent |
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| 337 |
_asin medio _2rdamedia |
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| 338 |
_avolumen _2rdacarrier |
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| 999 |
_c5041 _d5041 |
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